Bluetooth LE 5.3 module for automotive and professional applications
- Professional grade modules support Thread, Zigbee, and Matter
- FlexCAN and LIN bus interfaces for automotive grade modules
- Powerful Cortex-M33 with open CPU architecture for customized applications
- Full set of enhanced security features with NXP EdgeLock
- Extended temperature range up to 85 °C or 105 °C
- Global certification